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| (R) SMLVT3V3 LOW VOLTAGE TRANSILTM FEATURES s s s s s s UNIDIRECTIONAL TRANSIL DIODE PEAK PULSE POWER : 600 W (10/1000s) REVERSE STAND-OFF VOLTAGE = 3.3 V LOW CLAMPING FACTOR FAST RESPONSE TIME UL RECOGNIZED DESCRIPTION The SMLVT3V3 is a Transil diode designed specifically for protecting 3.3V supplied sensitive equipment against transient overvoltages. Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes then particularly suited to protect voltage sensitive devices surb as MOS technology and low voltage supply IC's. SMB (JEDEC DO-214AA) ABSOLUTE MAXIMUM RATINGS (Tamb = 25C) Symbol PPP P IFSM Tstg Tj TL Parameter Peak pulse power dissipation (see note 1) Power dissipation on infinite heatsink Non repetitive surge peak forward current Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s Tj initial = Tamb Tamb = 75C tp = 10 ms Tj initial = Tamb Value 600 5 50 - 65 to + 175 175 260 Unit W W A C C C Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. THERMAL RESISTANCE Symbol Rth (j-l) Rth (j-a) Junction to leads Junction to ambient on printed circuit on recommended pad layout Parameter Value 20 100 Unit C/W C/W August 2001 - Ed : 2 1/4 SMLVT3V3 ELECTRICAL CHARACTERISTICS (Tamb = 25C) Symbol VRM VBR VCL IRM IPP Parameter Stand-off voltage. Breakdown voltage. Clamping voltage. Leakage current @ VRM. Peak pulse current. Voltage temperature coefficient Forward voltage drop I PP VCL VBR V RM VF I RM V IF I T VF IRM @ VRM max Type VBR @ IR min note 2 VCL @ IPP max 10/1000 s V 7.3 A 50 VCL @ IPP max 8/20 s V 10.3 A 200 T max note 3 10-4/C -5.3 C max note 4 pF 5200 A SMLVT3V3 200 V 3.3 V 4.1 mA 1 Fig. 1 : Peak pulse power dissipation versus initial junction temperature (printed circuit board). PPP[Tj initial] PPP[Tj initial = 25C] % IPP 100 10 S P U L SE W AVE FO RM 1 0 /1 0 0 0 S 50 0 10 00 S T 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Tj initial (C) 0 25 50 75 100 125 150 175 200 Note 2 : Pulse test : tp < 50 ms Note 3 : VBR = T * (Tamb - 25) * VBR(25C). Note 4 : VR = 0V , F = 1MHz. 2/4 SMLVT3V3 Fig. 2 : Peak pulse power versus exponential pulse duration (Tj initial = 25C). Fig. 3 : Clamping voltage versus peak pulse current (Tj initial = 25C). Exponential waveform tp = 20 s and tp = 1 ms. V C L (V ) 10 Ppp(kW) 10.00 1.00 TP= 2 0 S 8 TP= 1 MS 0.10 tp(ms) 0.01 0.01 6 IPP(A ) 0.10 1.00 10.00 4 0 .1 1 .0 1 0 .0 1 0 0 .0 Fig. 4 : Capacitance versus reverse applied voltage (typical values). Fig. 5 : Peak forward voltage drop versus peak forward current (typical values). C (PF ) 5000 4000 3000 F=1M H Z T J= 2 5 C 2000 V R (V ) 1000 1 2 3 4 5 Fig. 6 : Transient thermal impedance junction ambient versus pulse duration. Mounting on FR4 PC Board with Recommended pad layout. Fig. 7 : Relative variation of leakage current versus junction temperature. 3/4 SMLVT3V3 ORDER CODE SM LVT 3V3 SURFACE MOUNT STAND-OFF-VOLTAGE LOW VOLTAGE TRANSIL PACKAGE MECHANICAL DATA SMB (Plastic) - Jedec DO-214AA DIMENSIONS REF. Millimeters Min. D E1 Inches Min. Typ. Max. Typ. Max. 2.15 0.15 A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 2.45 0.075 0.085 0.096 0.20 0.002 0.006 0.008 2.20 0.077 0.41 0.006 0.087 0.016 E A1 A2 L b c E c 5.40 4.30 3.60 1.15 5.60 0.201 0.213 0.220 4.60 0.159 0.169 0.181 3.95 0.130 0.142 0.156 1.60 0.030 0.045 0.063 E1 D L FOOTPRINT DIMENSIONS (Millimeter) SMB Plastic. Marking: Logo, data code, type code and cathod band Weight = 0.12 g 2.3 Packaging : standard packaging is in tape and reel. 1.52 2.75 1.52 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4 |
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